Laser Dicing Process Optimization on Production Wafer Experiment II 1.0 (val)
4.03Speed (wafer/hr)BOLD + Expert
Evaluation results
| Method | Links | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BOLD + ExpertDescription=Human-in-the-loop approach using BOLD-A as starting point for manual refinement2025.11 | 4.03 | 444 | 388 | 31.6 | 0.5 | 0.05 | 0 | 0 | 0 | 1 | — | |
| DatabaseDescription=Pre-existing, off-the-shelf industrial configuration2025.11 | 3.7 | 496 | 397 | 33.2 | 0.5 | 0.5 | 0.33 | 0 | 0 | 1 | — | |
| BOLD-CDescription=Post-hoc configuration using weights strongly prioritizing production speed2025.11 | 3.34 | 488 | 396 | 31.7 | 0.5 | 0.05 | 0 | 0.16 | 0 | 1 | — | |
| BOLD-ADescription=Maximum a posteriori (MAP) estimate using full dataset and original expert utility weights2025.11 | 3.25 | 475 | 424 | 29.6 | 1 | 0.1 | 0 | 0 | 0 | 1 | — | |
| Database + ExpertDescription=Iterative refinement of Database baseline by process engineer2025.11 | 3.01 | 443 | 419 | 28.1 | 0.5 | 0.01 | 0 | 0 | 0 | 1 | — | |
| BOLDDescription=Best-found feasible configuration discovered during optimization2025.11 | 2.81 | 496 | 394 | 28.9 | 0.5 | 0.02 | 0.04 | 0 | 0 | 1 | — | |
| BOLD-BDescription=Post-hoc configuration using weights strongly prioritizing die strength2025.11 | 2.78 | 435 | 409 | 28.6 | 1 | 0.05 | 0.08 | 0 | 0 | 1 | — |