Laser Dicing Process Optimization on Bare Silicon Wafer 60 µm (val)
3.77Throughput (wafer/hr)BOLD
Evaluation results
| Method | Links | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| BOLDconfiguration=optimized process configuration2025.11 | 3.77 | 67,157 | 61,340 | 28.9 | 2 | 0 | 0 | 0 | 100 |
| Method | Links | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| BOLDconfiguration=optimized process configuration2025.11 | 3.77 | 67,157 | 61,340 | 28.9 | 2 | 0 | 0 | 0 | 100 |